职位描述
Location – Shenzhen / Dongguan / Shanghai
Main Responsibilities:
- Support customers from first problem analysis, cleaning trials, technical reporting, follow up all the way down to process start up.
- Liaise with international colleagues during technology evaluation / problem solving for multinational customers.
- Preparation of demonstrations for seminars, trade shows presentations, trainings and etc.
Requirements:
- At least university degree on chemical engineering, mechanical engineering, or electronics engineering. PHD or Master degree will be a plus.
- At least 3 years engineering experience in SMT or chip packaging production or relevant fields.
- Excellent in English both on oral and writing. Good reporting and presentation skills.
- Strong analytical and problem solving skills. Good interpersonal and social skills.